In 2025, high-bandwidth memory (HBM) has surged to the forefront of microelectronics innovation, quickly becoming a critical enabler of AI performance.
In early 2025, speculation surfaced about a potential merger between Taiwan-based United Microelectronics Corporation (UMC) and U.S.-based GlobalFoundries, a move that could shake up the global semiconductor landscape.
In a dynamic push to bolster national security and technological prowess, the U.S. Department of Defense (DoD) has embarked on a groundbreaking initiative: the Microelectronics Commons Hubs Tour.
n an age where technological advancement shapes the very fabric of national security, the modernization of defense microelectronics has emerged as a paramount priority.
Electronic components are the essential building blocks of all modern electronic devices, each playing a specific role in ensuring the functionality and performance of electronic systems.
In an industry where precision, reliability, and trust are paramount, obtaining and maintaining these certifications can set a distributor apart from the competition