The scaling of AI infrastructure is no longer constrained solely by compute or memory.
The trajectory of China’s semiconductor industry is often described through the lens of restriction—export controls, equipment limitations, and access constraints.
In 2025, the microelectronics industry is witnessing a major shift toward wide‑bandgap (WBG) semiconductors — especially Silicon Carbide (SiC) and Gallium Nitride (GaN) — as demand accelerates for high‑efficiency power devices, EVs, renewable‑energy systems, and high‑frequency telecommunications infrastructure.
In a decisive move to reshape the domestic landscape of electronic components manufacturing, the Department of Defense has allocated $269 million under the CHIPS Act, marking a pivotal moment in U.S. industrial policy.
MicroLED displays have emerged as a promising technology poised to revolutionize the visual display industry.
The intersection of artificial intelligence (AI) and microelectronics is revolutionizing the technological landscape, driving significant advancements in both fields.
In the ever-evolving world of microelectronics, advanced packaging technologies are making significant strides, with glass core substrates emerging as a groundbreaking innovation.
In a dynamic push to bolster national security and technological prowess, the U.S. Department of Defense (DoD) has embarked on a groundbreaking initiative: the Microelectronics Commons Hubs Tour.
n an age where technological advancement shapes the very fabric of national security, the modernization of defense microelectronics has emerged as a paramount priority.
The synergy between microelectronics and quantum computing holds the promise of ushering in a new era of technological advancement.
The microelectronics industry in 2025 faces a complex array of challenges, particularly in the context of the BRICS nations.
U.S. defense spending on electronic components is a critical aspect of maintaining military readiness and superiority.