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As 2025 draws to a close, a growing structural imbalance in the semiconductor memory market is beginning to influence multiple high‑volume industries. Leading DRAM manufacturers — including Samsung, SK Hynix, and Micron — are increasingly prioritizing production capacity for high‑bandwidth memory (HBM) and server‑oriented DRAM to meet surging demand from artificial‑intelligence (AI) data centers and large‑scale…

A new cross-sector partnership announced in April aims to streamline access to space-grade microchips for emerging satellite platforms, a development poised to reshape procurement practices across both commercial and defense aerospace markets.

As the semiconductor industry pushes the boundaries of performance and efficiency, 3D Integrated Circuit (3D IC) technology is emerging as a revolutionary advancement.