The 2025 IEEE International Electron Devices Meeting (IEDM), held in December in San Francisco, once again affirmed its place as the premier venue for unveiling next-generation semiconductor technologies.
Sonoran Electronics
In 2025, high-bandwidth memory (HBM) has surged to the forefront of microelectronics innovation, quickly becoming a critical enabler of AI performance.
In early 2025, speculation surfaced about a potential merger between Taiwan-based United Microelectronics Corporation (UMC) and U.S.-based GlobalFoundries, a move that could shake up the global semiconductor landscape.
In an age defined by digital computation, artificial intelligence, and software-defined everything, it’s easy to overlook the quiet resilience of analog microelectronics.
Modern microelectronics are marvels of precision engineering, containing billions of transistors packed into areas smaller than a fingernail. Yet few outside the semiconductor industry truly understand how these chips are made.
As commercial and governmental interest in space exploration and satellite infrastructure accelerates, the demand for microelectronic components that can survive—and thrive—in the harsh conditions of space has never been greater.
As global data volumes surge, driven by artificial intelligence, cloud computing, and streaming media, traditional electronic interconnects are approaching their physical and economic limits. In response, photonic microelectronics—a hybrid field that merges optical communication with semiconductor microfabrication—is emerging as a vital solution for high-speed, low-latency data transmission.
As consumer expectations for vivid visuals, precise color rendering, and energy-efficient displays continue to rise, the microelectronics industry has responded with one of the most significant innovations in modern display engineering: quantum dot (QD) technology.
Autonomous vehicles (AVs)—from passenger cars to last-mile delivery robots—are no longer a distant vision. Rapid strides in perception, navigation, and decision-making technologies are propelling self-driving systems closer to large-scale deployment. Central to this evolution is the advancement of microelectronics, which form the foundational layer enabling AVs to sense their environment, process data in real time,…
The global semiconductor industry, valued at over $600 billion in 2024, remains a linchpin of the modern economy. Yet despite its technological sophistication, the sector continues to face significant supply chain vulnerabilities.
April marked a significant checkpoint in the implementation of the CHIPS and Science Act, as the U.S. Department of Commerce released its first detailed progress summary on disbursed funding and forthcoming allocations.
The integration of 3D-stacked microelectronics has emerged as a pivotal enabler of next-generation defense systems, offering substantial gains in computational density, bandwidth, and thermal efficiency. In April, multiple defense technology programs—both classified and unclassified—publicly confirmed the transition of their embedded platforms toward vertically integrated chip architectures, driven by the operational need for compact, high-performance computing…