In 2025 the microelectronics industry finds itself at a pivotal juncture as sweeping tariff threats and export control dynamics begin to reshape global supply chains in real time. For companies sourcing chips, components, and packaging, the evolving trade‑policy landscape is no longer a background risk, but a central operational factor.
Recent actions by the United…
A significant shift is underway in semiconductor manufacturing: equipment for panel‑level packaging (PLP) is seeing rapid growth as manufacturers look to meet performance, cost, and throughput demands of next‑generation microelectronics.
The recent decision by Nexperia to halt shipments to its Chinese manufacturing facility has sent a sharp warning through global microelectronics supply chains.
In 2025, the release of the MAPT Roadmap 2.0 by the Semiconductor Research Corporation (SRC) marks a pivotal moment for the microelectronics industry.
The market for advanced semiconductor packaging is fast emerging as one of the most critical and dynamic segments in the microelectronics supply chain.
As transistors have shrunk and compute performance has skyrocketed, one stubborn bottleneck has remained: interconnects.
The rise of generative artificial intelligence is not limited to content creation and chatbots—it is now firmly entering the fabric of microelectronics design.
In an era where microelectronic components underpin critical infrastructure, defense systems, and consumer devices, the integrity of integrated circuits (ICs) is under increasing threat.
The 2025 IEEE International Electron Devices Meeting (IEDM), held in December in San Francisco, once again affirmed its place as the premier venue for unveiling next-generation semiconductor technologies.
In 2025, high-bandwidth memory (HBM) has surged to the forefront of microelectronics innovation, quickly becoming a critical enabler of AI performance.
In early 2025, speculation surfaced about a potential merger between Taiwan-based United Microelectronics Corporation (UMC) and U.S.-based GlobalFoundries, a move that could shake up the global semiconductor landscape.
In an age defined by digital computation, artificial intelligence, and software-defined everything, it’s easy to overlook the quiet resilience of analog microelectronics.