The recent decision by Nexperia to halt shipments to its Chinese manufacturing facility has sent a sharp warning through global microelectronics supply chains.
In 2025, the release of the MAPT Roadmap 2.0 by the Semiconductor Research Corporation (SRC) marks a pivotal moment for the microelectronics industry.
The market for advanced semiconductor packaging is fast emerging as one of the most critical and dynamic segments in the microelectronics supply chain.
In early 2025, speculation surfaced about a potential merger between Taiwan-based United Microelectronics Corporation (UMC) and U.S.-based GlobalFoundries, a move that could shake up the global semiconductor landscape.
Modern microelectronics are marvels of precision engineering, containing billions of transistors packed into areas smaller than a fingernail. Yet few outside the semiconductor industry truly understand how these chips are made.
The global semiconductor industry, valued at over $600 billion in 2024, remains a linchpin of the modern economy. Yet despite its technological sophistication, the sector continues to face significant supply chain vulnerabilities.
The semiconductor industry, long associated with rapid innovation and technological advancement, is increasingly being scrutinized for its environmental impact.
For decades, Moore’s Law—a prediction that the number of transistors on a microchip would double approximately every two years—has served as a guiding principle for the semiconductor industry.